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Appendix B: Publicly-Available Bath Chemistry Data

Printed Wiring Boards Cleaner Technologies Substitutes Assessment: Making Holes Conductive

B.1 Range of Bath Concentrations for the Electroless Copper Technology

B.2 Bath Concentrations for the Carbon Technology, Non-Conveyorized

B.3 Bath Concentrations for the Carbon Technology, Conveyorized

B.4 Product Concentrations for the Conductive Ink Technology

B.5 Bath Concentrations for the Conductive Polymer Technology

B.6 Range of Bath Concentrations for the Graphite Technology

B.7 Bath Concentrations for the Non-Formaldehyde Electroless Copper Technology

B.8 Bath Concentrations for the Organic-Palladium Technology

B.9 Range of Bath Concentrations for the Tin-Palladium Technology

Table B.1 Range of Bath Concentrations for the Electroless Copper Technology

Bath Chemicalsa Bath Concentration (g/l)
Low High Average
Cleaner/Conditioner Sulfuric Acid
p-Toluene Sulfonic Acid
Isopropyl Alcohol; 2-Propanol
Hydroxyacetic Acid
Potassium Hydroxide
Ammonium Chloride
Formic Acid
Cationic Emulsifier
Triethanolamine
Phosphate Ester
Ethylene Glycol
Dimethylformamide
Confidential Ingredients
Ethanolamine
9.90
9.90
1.65
34.7
0.53
12.9
12.9
6.44
30.3
30.3
2.44
1.32
2.00
16.3


6.44


3.36
Micro-Etch Potassium Peroxymonosulfate
Potassium Bisulfate
Potassium Sulfate
Magnesium Carbonate
Potassium Persulfate
Sulfuric Acid
Hydrogen Peroxide
Sodium Hydroxide
Copper Sulfate - Pentahydrate
Ethylene Glycol
25.8
13.8
19.2
1.20
9.80
1.84
13.8
0.30
0.50
1.93





340
35.9





121
19.9
Predip Sodium Bisulfate
HCL
Sulfuric Acid
2.58
31.7
2.58
46.6
182
24.6
85.6
Catalyst Hydrochloric Acid
Stannous Chloride as Tin (II)
Palladium (Dissolved)
Methanol
Sodium Bisulfate
Sodium Sulfate
Sodium Hydroxide
1.98
6.32
0.36
2.52
45.2
12.6
2.53
158
16.6
50.9
10.3
Accelerator Sodium Chlorite
Sulfuric Acid
Sodium Hypophosphite
Fluoboric Acid
4.52
18.2
8.58
60.0



60.0



60.0
Electroless Copper Formaldehyde
Copper Chloride
Copper Sulfate as Copper
Hydrochloric Acid
Sodium Hydroxide
Ethylenediamine-Tetraacetic Acid
   Tetrasodium Salt (EDTA)
Methanol
Potassium Cyanide
Potassium-Sodium Tartrate
Sodium Carbonate
Tartaric Acid
Sodium Cyanide
Alkaline Mixture
Sulfuric Acid
1.58
5.06
4.79
0.48
5.78
34.2

0.04
0.22
31.4
0.05
1.03
0.23
154
1.15
5.59
8.32
11.6

15.7
56.2

2.80
3.68
6.69
6.98

10.1
45.2

1.39
Acid Dip Sulfuric Acid
Dimethylaminoborane
Boric Acid
NR
0.72
5.00


Anti-Tarnish Methanol
Sulfuric Acid
Isopropyl Alcohol
Potassium Hydroxide
Benzotriazole
2-Ethoxyethanol
Sodium m-Nitrobenzenesulfonate
0.95
28.8
2.02
0.30
0.12
45.9
0.12
1.25 1.10
Cleaner/Conditioner Nonionic Surfactant
Potassium Carbonate
Monoethanolamine; 2-Aminoethanol
Triethanolamine; 2,2'2"-Nitrilotris (Ethanol)
2-Propanol
Surface Agent (non-haz)
4.50
6.16
14.2
5.1
2.04
15.3


25.4
25.4


19.8
15.2
Predip Sodium Bisulfate
Sodium Chloride
Hydrochloric Acid
46.6
360
1.85


17.1


10.3
Catalyst Sodium Bisulfate
Sodium Chloride
Hydrochloric Acid
Tin(II) chloride, Stannous Chloride as Tin
Palladium (Dissolved)
Palladium Chloride
Vanillin
1,3-Benzenediol
42.9
653
9.60
21.1
0.96
0.50
1.50
0.73


46.0
46.0

0.70


22.9
31.8

0.60
Accelerator Fluoroboric Acid as Fluoride
Copper as CU(II)
Copper Sulfate
Sulfuric Acid
Sodium Hydroxide
Potassium Carbonate
Lithium Hydroxide
Monoethanolamine
18.9
2.55
0.23
0.93
14.4
318
20.3
3.49


1.38

43.5


20.3


0.81

29.0


11.9
Micro-Etch Copper Sulfate as Copper
Sulfuric Acid
Phosphoric Acid
Hydrogen Peroxide
Sodium Persulfate: Disodium Peroxydisulate
13.3
9.20
NR
17.5
135

35.0


175

20.9


151
Acid Dip Sulfuric Acid 191

a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.2 Bath Concentrations for the Carbon Technology, Non-Conveyorizeda

Bath Chemicalsb Concentration in Bath
Cleaner Monoethanolamine
Ethylene Glycol
11.6
NR
Conditioner Monoethanolamine 11.5
Carbon Black Potassium Carbonate
Potassium Hydroxide
Sulfuric Acid
Carbon Black
62.3
0.46
0.04
NR
Micro-Etch Sodium Persulfate
Sulfuric Acid
Copper Sulfate Pentahydrate
200
1.84
5.0

a The carbon technology was the only MHC technology listing different chemical concentrations depending on the equipment configuration (e.g., conveyorized or non-conveyorized.)
b May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.3 Bath Concentrations for the Carbon Technology, Conveyorizeda

Bath Chemicalsb Concentration in Bath
Cleaner Monoethanolamine
Ethylene Glycol
12.7
NR
Conditioner Monoethanolamine 34.5
Carbon Black Potassium Hydroxide
Carbon Black
20.4
NR
Micro-Etch Sodium Persulfate
Sulfuric Acid
Copper Sulfate Pentahydrate
200
1.84
5.0

a The carbon technology was the only MHC technology listing different chemical concentrations depending on the equipment configuration (e.g., conveyorized or non-conveyorized.)
b May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.4 Product Concentrations for the Conductive Ink Technology

Bath Chemicalsa Constituent Concentration (weight %)
Micro-Etch Conventional micro-etch cleaning processes may be used as well as light brushing
Screen Print Ink
(5 different product formulations are listed)
Formulation A Silver
2-Butoxyethanol Acetate
Phenol-Formaldehyde Resin
Trade Secret Resin*
Methanol
Isophorone
Modifiers
60 - 80
15 - 25
5 - 10
1-5
< 5
1 - 2
< 1
Formulation B Additives & Modifiers
Silver-Coated Copper Powder
Phenol-Formaldehyde Co-Polymer
Diethylene Glycol Monomethyl Ether
< 5
70 - 90
1 0 -20
< 10
Formulation C Additives & Modifiers
Silver-Coated Copper Powder
Phenol-Formaldehyde Co-Polymer
Diethylene Glycol Monomethyl Ether
< 5
70 - 90
10-20
< 10
Formulation D Silver-Plated Copper Powder
Phenol-Formaldehyde Polymer
Diethylene Glycol Monomethyl Ether
Modifiers
80- 90
10 - 20
5 - 15
< 3
Formulation E Phenol-Formaldehyde Resin
Trade Secret Resin*
Graphite
Diethylene Glycol Butyl Ether
Diethylene Glycol Ethyl Ether
Carbon Black
Butyl Cellosolve Acetate
Methanol
20 - 30
25 - 35
10 - 20
10 - 20
< 10
5 - 10
5 - 10
< 5

a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

  Table B.5 Bath Concentrations for the Conductive Polymer Technology

Bath Chemicals a Bath Concentration (g/l)
Micro-Etch Potassium Peroxymonosulfate
Sulfuric Acid
100
20
Cleaner/Conditioner Natrium Carbonate (Sodium Carbonate) 7.5
Catalyst Phosphoric Acid
Alkali Permanganate
Sodium Hydroxide
2.75
815
0.9
Conductive Polymer Phosphoric Acid
Potassium Hydroxide in Azoles
26.8
3

a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.6 Range of Bath Concentrations for the Graphite Technology

Bath Chemicalsa Concentration in Bath (g/l)
Low High Average
Cleaner/Conditioner Non-Haz-Ingredients
Surfactant
Potassium Carbonate
Ethanolamine
437
2.06
7.39
19.7
 
Graphite Graphite
Non-Haz-Ingredients
Ammonia
29.8
127
1.95
61.2 45.5
Micro-Etch Sulfuric Acid
Sodium Persulfate
Potassium Peroxymonosulfate
Copper Sulfate as Copper
Non-Haz Ingredients
28.0 23.5
30.1
2.67
15.6
90.3
90.3
59.1
56.9

a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.7 Bath Concentrations for the Non-Formaldehyde Electroless Copper Technology

Bath Chemicalsa Bath Concentration
Cleaner/Conditioner  
Micro-Etch Potassium Persulfate
Sulfuric Acid
Hydrogen Peroxide
Sodium Hydroxide
Copper Sulfate - Pentahydrate
9.80
20.2
16.1
0.30
0.50
Predip  
Catalyst Hydrochloric Acid
Stannous Chloride
2.96
9.48
Postdip Hydrochloric Acid NR
Accelerator Sodium Chlorite 4.52
Electroless Copper/Copper Flash Copper Sulfate
Sulfuric Acid
Sodium Hydroxide
22.4
2.56
NR
Anti-Tarnish Isophopyl Alcohol
Potassium Hydroxide
2.02
0.30

a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

Table B.8 Bath Concentrations for the Organic-Palladium Technologya

Bath Chemicals Concentration in Bath (g/l)
Conditioner Trade Secret
AQ Solution, Cationic Resin
Sodium Carbonate
Sodium Bicarbonate
5
NR
3
5
Micro-Etch Sodium Persulfate
Sodium Bisulfate
75
75
Predip HCL Acid (25% pure) 3.12
Conductor HCL Acid
Trade Secret
Sodium Hypophosphite-1Hydrate
3
3
3.06
Postdip Sodium Carbonate
Trisodium Citrate - 5.5 Hydrate
Trade Secret
12.6
12.6
34.5

a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.

 

  Table B.9 Range of Bath Concentrations for the Tin-Palladium Technology

Bath Chemicalsa Low High Average
Cleaner/Conditioner Nonionic Surfactant
Potassium Carbonate
Monoethanolamine; 2-Aminoethanol
Triethanolamine; 2,2',2"-Nitrilotris (ethanol)
2-Propanol
Surface Agent (non-haz)
4.50
6.16
14.2
5.1
2.04
15.3


25.4
25.4


19.8
15.2
Predip Sodium Bisulfate
Sodium Chloride
Hydrochloric Acid
46.6
360
1.85


17.10


10.3
Catalyst Sodium Bisulfate
Sodium Chloride
Hydrochloric Acid
Tin(II) Chloride, Stannous Chloride as Tin
Palladium (dissolved)
Palladium Chloride
Vanillin
1,2-Benzenediol
42.9
653
9.60
21.1
0.96
0.50
1.50
0.73


46.0
46.0

0.70


22.9
31.8

0.60
Accelerator Fluoroboric Acid as Fluoride
Copper as Cu (II)
Copper Sulfate
Sulfuric Acid
Sodium Hydroxide
Potassium Carbonate
Lithium Hydroxide
Monoethanolamine
18.9
2.55
0.23
0.93
14.4
318
20.3
3.49


1.38

43.5


20.3


0.81

29.0


11.9
Micro-Etch Copper Sulfate as Copper
Sulfuric Acid
Phosphoric Acid
Hydrogen Peroxide
Sodium Persulfate; Disodium Peroxydisulfate
13.3
9.20
NR
17.5
135

35.0


175


20.9


151

Acid Dip Sulfuric Acid 191    

a May not include trade secret chemicals or those materials identified as "non-hazardous materials" on the MSDSs.


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