Jump to main content or area navigation.

Contact Us

facebook iconLike Us on Facebook 
You are here: EPA Home » DfE » Alternatives Assessments

Implementing Cleaner Technologies in the Printed Wiring Board Industry: Making Holes Conductive

ACKNOWLEDGMENTS

This report was prepared by Microelectronics and Computer Technology Corporation and The Institute for Interconnecting and Packaging Electronic Circuits as part of a multi-stakeholder, collaborative, Design for the Environment project. The EPA Project Officers were Kathy Hart and Debbie Boger of the Design for the Environment Staff of the Office of Pollution Prevention and Toxics. The report was constructed by Christopher Rhodes of the IPC and Greg Pitts of MCC, with valuable assistance in the preparation and review provided by: George Cushnie and Mark Eelman of CAI, Inc.; Steve Bold of Continental Circuits; Gary Roper of HR Industries; and Fritz Fehrer and Ted Smith of the Silicon Valley Toxics Coalition. Acknowledgment is also given to the members of the project Core Group, not mentioned above, who provided guidance and feedback throughout the preparation of the report, including: Michael Kerr of Circuit Center; John Lott of E.I. DuPont de Nemours; and Lori Kincaid of the University of Tennessee. Thanks also to Star Summerfield of the IPC and Jana Hellier of MCC for incorporating comments, editing, and formatting the report.

Jump to main content.