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NPEP Success Story: Micron Technology Puerto Rico, Inc.
Disclaimer Note
The success stories provided on this website were obtained from NPEP partners. EPA edited the descriptions for space, stylistic consistency, and clarity, but they were not written or officially endorsed by EPA. Reference herein to any specific company or commercial products, process, or service by trade name, trademark, manufacturer, or otherwise, does not necessarily constitute or imply its endorsement, recommendation, or favoring by the United States Government.
Micron Technology Puerto Rico, Inc. Reduces Lead by 72%
Micron Technology Puerto Rico, Inc. manufactures computer memory circuit boards for use as components in various types of electronic equipment. We are considered a world leader in the manufacture of memory microchip technology. Micron has been operating in Aguadilla, Puerto Rico, since May, 2003. We employ about 200 people and we produce more than 2,000,000 memory modules annually. We have three production lines and our process is composed of 10 operations, two of them inspection operations. Micron is actively engaged in efforts to protect our environment by reducing the use of lead in our manufacturing process.
Micron's NPEP Goal
Micron joined NPEP in April, 2006 and set an NPEP goal to reduce lead in our module line process from 815 to 415 pounds by the end of the year by switching to the use of lead-free solder paste. Our goal was to reduce lead from our screen print operation and rework area. In the screen print area, a machine puts solder paste on the stencil board automatically. After paste has been applied to three boards, the machine cleans up the excess paste.
NPEP Project Implementation
Prior to making the decision to reduce lead in our process, we engaged in extensive research, evaluation, and collaboration. In order to ensure compatibility, these efforts were made not only at the product engineering level at our Puerto Rico facility, but throughout the company. In 2005, we started phasing out the use of lead solder paste and began the switch to lead-free solder paste in some of our products. During the phase-out of the lead solder paste, the Engineering Department tested and validated the screen printer and reflow oven processes in the manufacturing process line.
Hurdles Faced
Lead is a critical component in electronics because it is uniquely capable of inexpensively meeting high technology performance standards. Lead was primarily used in a tin-lead solder alloy (the solder attaches computer chips and components to printed circuit boards). Our biggest hurdle was introducing this new lead-free solder paste into our manufacturing process. We started with the procurement process by providing information on the solder paste to our Purchasing Department. Our Engineering Department analyzed the solder paste storage conditions, use, process, quality, and other factors. Our Training Department provided complete training on the changes to our operators.
Waste Minimization Results
We surpassed our goal by reducing our use of lead by 588 pounds after switching to the use of lead-free solder paste. We increased production levels while maintaining our quality levels and manufacturing cost. We believe our efforts have helped to protect the environment.
Lessons Learned
Our project seemed like a difficult undertaking at first because of all the effort required throughout the company. However, by persevering, we achieved and surpassed our goal in the end. The use of lead-free solder paste was a significant technological change for our industry.